The COVID-19 pandemic has driven the Electronic Components shortage with severely Supply chain disrupted. The continue impact to global freight and logistics for longer Lead Times and Material Costs increased to supply chains remains a critical issue. Defense, Military and Aerospace sectors are faced with increases due to an upward trend in raw materials pricing…
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X-REL Semiconductor a division of EASii IC, designs innovative High-Reliability & High-Temperature Integrated Circuits and Systems. Products are made to reliably perform for years while ensuring the reduction of the overall system costs all along the product lifecycle. Easii IC is a fabless company working with worldwide recognized contractors which allows us to offer products…
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United Monolithic Semiconductors (UMS) European leader in RF MMIC – Monolithic Microwave Integrated Circuit (GaAs, GaN, SiGe technologies) Products and Foundry services for Defence, Space, Telecom, Automotive, and Radar is pleased to inform about 3 New products: CHA2595-98F 27.5-43.5GHz Low Noise Amplifier Ref: CHA2595-98F-FULL-1168 Product information: Performance to highlight: Wideband LNA: 27.5-43.5GHz Designed for a…
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Generic Specification for Microwave Monolithic Integrated Circuits. This specification defines the general requirements for the qualification approval, capability approval, procurement, including lot acceptance testing, and delivery of Monolithic Microwave Integrated Circuit (MMIC) components or naked dice for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements.…
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Generic Specification for Integrated Circuits,Monolithic And Multichip Microcircuits This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of Integrated Circuits for space applications as follows: • Monolithic and Multichip Microcircuits, wire-bonded, hermetically sealed packaged components • Flip-chip Monolithic Microcircuits, solder ball bonded, hermetically and non-hermetically sealed packaged components with and…
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Generic Specification for Discrete Microwave Semiconductor Components This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete microwave, semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES
The EPPL is divided into two parts: – Part I components have sufficient data to permit their use without any special provision, on condition that they meet the application requirements. – Part II components have minimum evaluation data demonstrating capability to satisfy Space-application requirements, but additional testing effort may be necessary to satisfy specific programme…
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Avalanche Technology, headquartered in Fremont, California, is the world leader in Spin Transfer Torque Magnetic RAM (STT-MRAM) non-volatile memory leveraging perpendicular magnetic tunnel junction (pMTJ) cell structure manufactured on 300mm standard CMOS process. Backed by more than 300+ granted patents around cell, circuit, and system design leveraging MRAM, our technology and products provide breakthrough speeds,…
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