Teledyne e2v HiRel offers high-performance, high-reliability of semiconductor products and package solutions to civil aerospace, industrial, medical, military and space applications. High reliability, or hi-rel, semiconductors have always been a difficult and specialized end of the chip market. Being confident that a given part will function at the most critical moments, under the worst radiation…
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United Monolithic Semiconductors (UMS) European leader in RF MMIC – Monolithic Microwave Integrated Circuit (GaAs, GaN, SiGe technologies) Products and Foundry services for Defence, Space, Telecom, Automotive, and Radar is pleased to inform about 3 New products: CHA2595-98F 27.5-43.5GHz Low Noise Amplifier Ref: CHA2595-98F-FULL-1168 Product information: Performance to highlight: Wideband LNA: 27.5-43.5GHz Designed for a…
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Advantages of Flex Cable Assemblies in Space: • reduced size and weight (up to 60% less weight and space) • ability to fold and form • reduced integration time • reducing failure rates during wiring • repeatability • Higher density designs due to smaller pitch sizes or multiple layers (up to 34 layers) • no…
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Generic Specification for Integrated Circuits,Monolithic And Multichip Microcircuits This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of Integrated Circuits for space applications as follows: • Monolithic and Multichip Microcircuits, wire-bonded, hermetically sealed packaged components • Flip-chip Monolithic Microcircuits, solder ball bonded, hermetically and non-hermetically sealed packaged components with and…
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Generic Specification for Discrete Microwave Semiconductor Components This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete microwave, semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES
Generic Specification for Discrete Semiconductor Components. This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES
The EPPL is divided into two parts: – Part I components have sufficient data to permit their use without any special provision, on condition that they meet the application requirements. – Part II components have minimum evaluation data demonstrating capability to satisfy Space-application requirements, but additional testing effort may be necessary to satisfy specific programme…
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This document contains a list of Qualified Manufacturers that have been certified by the European Space Agency for technology flows to the rules of the ESCC system with principle reference to ESCC Last version link on ESCIES
