Generic Specification for Integrated Circuits,Monolithic And Multichip Microcircuits
This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of Integrated Circuits for space applications as follows:
• Monolithic and Multichip Microcircuits, wire-bonded, hermetically sealed packaged components
• Flip-chip Monolithic Microcircuits, solder ball bonded, hermetically and non-hermetically sealed packaged components with and without passive (i.e. capacitors and resistors) Add-on Components
• Monolithic Microcircuit die components
This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements.
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