This document detail some Consulting Services for Procurement of High-Reliability Electronic EEE Parts for Military and Aerospace applications. WORK-PACKAGES: WP1 – Bill of Materials (BOM) Review WP2 – Parts Management Plan WP3 – Parts Evaluation Plan WP4 – PartsQualification Plan WP5 – PartsRadiation Plan WP6 – ProcurementSpecifications WP7 – IncomingInspections WP8…
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Generic Specification for Microwave Monolithic Integrated Circuits. This specification defines the general requirements for the qualification approval, capability approval, procurement, including lot acceptance testing, and delivery of Monolithic Microwave Integrated Circuit (MMIC) components or naked dice for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements.…
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Generic Specification for Integrated Circuits,Monolithic And Multichip Microcircuits This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of Integrated Circuits for space applications as follows: • Monolithic and Multichip Microcircuits, wire-bonded, hermetically sealed packaged components • Flip-chip Monolithic Microcircuits, solder ball bonded, hermetically and non-hermetically sealed packaged components with and…
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Generic Specification for Discrete Microwave Semiconductor Components This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete microwave, semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES
Generic Specification for Discrete Semiconductor Components. This specification defines the general requirements for the qualification, qualification maintenance, procurement, and delivery of hermetically sealed, packaged and die, discrete semiconductor components for space applications. This specification contains the appropriate inspection and test schedules and also specifies the data documentation requirements. Last version link on ESCIES
The ESCC Executive publishes a list of active and valid Process Capability Approval Certificates for manufacturing Lines of Hybrid Microcircuits, the ESCC HPCL (Hybrid Process Capability Approval List). Last version link on ESCIES
The EPPL is divided into two parts: – Part I components have sufficient data to permit their use without any special provision, on condition that they meet the application requirements. – Part II components have minimum evaluation data demonstrating capability to satisfy Space-application requirements, but additional testing effort may be necessary to satisfy specific programme…
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This document contains a list of Qualified Manufacturers that have been certified by the European Space Agency for technology flows to the rules of the ESCC system with principle reference to ESCC Last version link on ESCIES
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