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Category: Components

AirBorn – FLEX Assemblies for Space Applications

Advantages of Flex Cable Assemblies in Space: • reduced size and weight (up to 60% less weight and space) • ability to fold and form • reduced integration time • reducing failure rates during wiring • repeatability • Higher density designs due to smaller pitch sizes or multiple layers (up to 34 layers) • no…
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ESCIES – European Space Components Information Exchange System

The European Space Components Information Exchange System (ESCIES) establish an information exchange system on component data with access available to all European users. ESCIES aims to systematically collect and make available this data to the European space component community. Large companies have built up databases through their role as a prime contractor. However, medium and…
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MIL Standards & Performance Specification system

U.S. Defense Military Specifications and Standards as “MIL-STD” and “MIL-PRF” are used to achieve standardization requirements for Quality, Reliability and Cost of Ownership compatibility on stringent applications. Related documents, such as defense handbooks and defense specifications, are herein addressed. SPECIFICATION DESCRIPTION MIL-STD-202 Test Method Standard, Electronic and Electrical Components This standard establishes uniform methods for…
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Avalanche Technology – The Next-Generation MRAM Company

Avalanche Technology, headquartered in Fremont, California, is the world leader in Spin Transfer Torque Magnetic RAM (STT-MRAM) non-volatile memory leveraging perpendicular magnetic tunnel junction (pMTJ) cell structure manufactured on 300mm standard CMOS process. Backed by more than 300+ granted patents around cell, circuit, and system design leveraging MRAM, our technology and products provide breakthrough speeds,…
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NanoXplore FACTS SHEET quarterly

Major news are : NXmap3.5.0.4 available from https://download.nanoxplore.com NG-Medium QML-V CQFP-352 qualification datapack has been submitted to DLA for approval as well as the SMD 5962F20217. The one related to CLGA-625 will follow. NG-Large CLGA-1752 ESCC qualification is still running with completion expected H1CY22, NX will perform an ECSS-Q-ST-70-61 evaluation of both CCGA-625 and CCGA-1752 PCB…
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UMS CHA8212-99F & CHT4660-FAB

United Monolithic Semiconductors (UMS), European leader RF MMIC – Monolithic Microwave Integrated Circuit (GaAs, GaN, SiGe technologies) products and foundry services for Aerospace, Defence, Telecom, Automotive Radar and Industrial sensors. CHA8212-99F 25W X-Band High Power Amplifier Ref: CHA8212-99F-FULL-0358  (Ex AI1908) Product information: 25W X-Band GaN High Power Amplifier Very versatile amplifier 44dBm Pout @ 20dBm…
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NanoXplore FACTS SHEET quarterly

Major news are : NXmap3 news available from https://download.nanoxplore.com NG-Medium QML-V CQFP-352 qualification with Delta ESCC evaluation is completed. The DLA approval will come in coming weeks as well as the relevant SMD 5962F20217, The CLGA-625 qualification is still running as expected. NG-Large CLGA-1752 ESCC qualification is running, NG-Ultra v1 device evaluation almost completed. NG-Ultra final version…
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Apogee Semiconductor – TalRad™ Process Design

Apogee Semiconductor, a provider of technologies and products for space and other extreme environments, announced today their TalRad™ Process Design Kit is available for evaluation. The Transistor-Adjusted-Layout for Radiation (TalRad™) Process Design Kit (PDK) is a rad-hard process design methodology that improves the radiation performance of commercial process technologies, enabling the rapid creation of rad-hard designs…
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